Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ultra-High Density System-in-Package (SiP) for The Lowest Size Weight and Power (SWAP)|
|Keywords: Fan out WLCSP, Heterogeneous, Lowest SWAP|
|Fan out wafer level packages have emerged across the market in an effort to reduce size and weight of electronics used in portable and wearable applications in the commercial, Industrial as well as the hi-Reliability space. If it is not a stationary platform, weight reduction is imperative. For the stationary platforms, volume and power are most critical. Integration of multiple complex heterogeneous IC components can only be done if there are a sufficient number of interconnect layers. Additionally, multiple interconnects are needed for transmission line creation and shielding. This talk provides an introduction to Aurora Semiconductor high density packaging technology i.e. iUHD (integrated Ultra High Density) and compares it with other alternative technologies. The Aurora iUHD technology is a 2.5D/3D FOWLCSP including embedded components, TSV, multi-layer top and bottom interconnects|
|Bruce Barbara, Director of Technical Marketing
Aurora Semiconductor LLC.
St. Petersburg , FL