Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|New Low Temperature Alloy Core-Shell Structures for Joining Applications|
|Keywords: core-shell, joining, low temperature alloys|
|Silver and copper core-shell powder materials are introduced and discussed in low temperature joining applications. Properties of the core-shell powders are reviewed and suggested process conditions are shown. Examination of ductile fracture area corroborate bonding strength results for both silver and copper core-shell materials. Selectable materials sets are presented to address different application process needs for lead-free systems.|
|Richard Stephenson, CTO
Silicon Valley Materials Technology Corp