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The Impact of Stencil Printing Upon Assembly & Reliability of 0.3mm Pitch CSP Components
Keywords: 0.3CSP, Assembly, Reliability
With shrinking component technology the stencil printing process is becoming increasingly challenged. Not only do long established design rules need to be broken to accommodate finer pitches, but print quality and consistency of print are becoming even more critical in delivering a high yield assembly process. A major body of work has been undertaken, looking at several different aspects of the stencil printing process and their impact upon the assembly process and ultimate reliability of 0.3CSP components. In the first instance, factors concerning the stencil printing process such as stencil aperture size & shape, together with standard & active (ultrasonic) squeegees were investigated. Key learning's were then applied to the assembly of actual components which were subsequently subjected to extensive reliability testing. From the data analysis, it is quite clear that the stencil process can have a huge impact on the ultimate solder joint reliability of 0.3mm pitch CSP assemblies. Stencil aperture size is naturally critical to the process but of greater importance was the use of active (ultrasonic) squeegees which opened up significantly the process window when compared to a standard squeegee approach. Full supporting data will be provided.
Mark Whitmore, Senior Manager, Advanced Print Technologies
ASM Assembly Systems
Weymouth, Dorset
UK


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