Abstract Preview

Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

NSOP Reduction for QFN RF-IC packages
Keywords: NSOP, RF-IC, AOI
NSOP- Non-Stick on Pad is a defect in wire bonding process which can impact front end assembly yields. The yield improvement was done with process mapping, isolating failures and conducting failure analysis and designed experiments for QFN assembly process optimization. Additionally, AOI was implemented at wafer backend to screen out defects escaping to assembly operations. The paper reviews the process improvements and optimization implemented at various steps in the process flow to reduce DPPM and facilitate yield improvement.
Mumtaz Y. Bora, Sr,. Staff PackagingEngineer
Peregrine Semiconductor
San Diego, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic