Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Improvement of coherency of the panel lebel package by Integrated Dry Process.|
|Keywords: Dry process, Photodesmear, PVD sputter|
|For late years, Semi Additive process is considered to dry processing for the downsizing of the semiconductor packages. WET process is a process depending on the chemical reaction of the chemical solution. There are many problems with the formation of the minute redistribution layer. We repeated the study of the Photodesmear technology as a new technology of the dry process, reported result in IMAPS in 2015 and 2013. We completed a panel level experiment tool equipped with a high power irradiation light source. We report findings of the coherency improvement by integrated dry process which fused in a Photodesmear technology and a dry seed technology. We confirmed the following effects in Integrated dry process. Desmear of microvia was enabled at a panel level. We was able to keep flatness characteristics of the resin before the plating low. We was able to confirm strong coherence of the via filled plating. VUV light irradiation is effective for the residue that is left when removing the protective film before the pre-dry seed layer process. Integrated dry process is a key technology to establish the next generation semi additive process.|
|Shinichi Endo, Project leader