Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Smartflux Dipping Paste for Advanced Packaging|
|Keywords: Dipping paste, Smartlflux, Substrate|
|Chip-packaging is increasingly complex while feature or pitch size continue to shrink. The transition from 100um standard flip chip bump, 50um fine pitch bump and 20~30um micro-bumps are very demanding for solder bumping process. Typically flux is applied to bumps during attachment of flip chip bumps to substrate pads. The role of flux is to remove oxides on solder bumps during reflow process and does little else. Stencil printing and electroplating process of flip chip solder bumps are subjected to variations at die level and wafer level. Bump heights variations and substrates warpage post challenges during solder bump attachment to substrates. The application of Smartflux dipping paste during bump attachment to substrate has several advantages over traditional flux in mitigating these challenges. Smartflux can compensate bump height variations and substrates warpage. We will discuss the application consistency and work-life of Smartflux in this poster.|