Micross

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TBD - Consideration of silver sinter paste for NiAu PCB substrate
Keywords: silver sinter paste, NiAu, PCB Substrate
Conductive adhesive has been the popular choice for NiAu PCB substrate as it has a lower curing temperature and shorter curing time. However, conductive adhesive has relatively lower thermal and electrical conductivity among all interconnect die attach material. Consideration of silver sinter paste for NiAu PCB substrate is on the raise due to several of its advantages. Silver sinter paste is one of the key solution to the increasing demand for high thermal and reliable devices. It is also lead free and halogen free which is very much in line with the future environmental requirement of the industry. Previously there has been much work developed for pressure sinter paste and pressure-less sinter with higher operation temperature of at least 230°C for other applications in the power module and power MOSFET segment. A low temperature micron scale silver sinter paste that can be sintered at 200°C has been developed to work particularly well for NiAu substrate. 200°C sintering temperature would be favorable for PCB substrate as it minimize the risk of PCB epoxy laminate decomposition during the long sintering profile. In this study, the properties and application processes of this paste would be reviewed. In addition, the limitation of this silver sinter paste and future work in this area would also be discussed.
Ryan Herrmann,
Heraeus
,
USA


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