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New Non Conductive Film for Collective Bonding Process
Keywords: bonding, productivity, NCF
Flip Chip bonding process is widely used for small, thin packaging applications. NCF is one of promising candidates for fine and/or 3D packaging process due to its intrinsic fine bump filling nature, small fillet property. So NCF process is adapted some fine Flip Chip packaging. However, conventional NCF process is sequential process, it takes long time for chip bonding. To overcome the productivity, we reported the gang bonding process (1). The gang bond process concept is to separate pre and post bonding processes. At first chip is pre-bonded on a substrate or wafer. Pre-bonding requires short time like a few second. Then post bonding was executed with multi pre-bonded chips. So the gang process improves the tact time drastically. Ideal post bonding is constant high temperature (200-300C). Applying for the gang bond process, NCF should be stable on hot stage and quick hardening is desirable. In addition, 3D packaging is another NCF application. For 3D packaging, temperature difference from bottom die to top die is critical issue for bonding process. For the application, NCF must be insensitive for temperature difference. In this article, we studied the NCF design for gang bond and 3D multi stack bond (collective bonding) from the point of stage stability and hardening nature. Considering those requirements, we succefully developed the Novel Non Conductive Film (NCF) for collective bonding process. To meet 4 layer multi die collective bonding, we add viscosity stability on a hot stage and snap cure property at higher than 140C. In addition, the NCF is transparent for optical alignment process.
Masao Tomikawa, Research Fellow
Toray Industries
Otsu, Shiga

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