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Directions and challenges in IC packaging: focus on fan out packaging
Keywords: PSB, RDL, FO WLP
IC packaging is being pushed to produce smaller, more capable and lower cost packaging at an ever faster pace. This is particularly true with the slowdown in FAB node introductions, with packaging technologies now being pushed to fill the gap. This means that packaging technology will have to be implemented more expeditiously and not depend on FAB node progressions to drive performance/cost. This requires expediting existing technology and synergistic applications of technology from other areas. A promising current packaging area is fan out packaging; this technology appears to be gaining traction with a flurry of new versions. The passivation stress buffer and RDL approach is finding acceptance in high IO fan out applications and as an addition to substrate technology to replace interposers. In this talk we will review these trends and the challenges for materials in these applications.
Edward Prack,
Phoenix, Az

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic