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Slot Die Coating for Wafer Level Packaging Applications
Keywords: Slot die coating, Packaging, Material utilization
Slot die coating is a direct deposition technology used to deposit a variety of liquid chemistries onto various substrates for the development and manufacture of a broad range of devices. The technology has achieved market success in a range of applications, such as flat panel displays (including LCD, OLED, flexible, and others), photovoltaic panels (such as CIGS, CdTe, and OPV), Solid State Lighting (OLED and LED), and various Organic and Printed Electronic applications such as RFID, Polymer Batteries, and Sensors. For packaging applications, slot die coating is typically considered as an alternative to spin coating. The spin coat process is a mature, well understood method that remains a dominant process for the application of various layers in the manufacture of semiconductors on silicon wafers. The spin process, which works best for round substrates, has been extended to the coating of various layers in packaging, at the wafer level and the “reconfigured” wafer level. However, spin coating suffers from relatively poor material utilization and does not extend well to rectangular substrates. As manufacturers consider the move to larger, rectangular substrates for packaging, the coating methods for the liquid chemistries must also be considered. Slot die coating is well suited to the rectilinear shape, and also offers excellent material utilization – of particular importance given the potentially high cost of the coating materials and the margin pressures of the packaging industry. But other factors must also be considered, including any differences in the coated film properties, as well as the effect on downstream processing steps. The presentation will provide an overview of the slot die coating technology and resulting films, with a particular emphasis on dielectric coating for packaging applications.
Greg Gibson, CTO
nTact
Dallas, TX
USA


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