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Characterizing and Solving Imaging Challenges in Thick Resists for Wafer and Panel based Lithography Applications
Keywords: Thick Resists, Lithography, Wafer and Panel based
Increasing volume using larger substrates with decreasing process margins continues to create new challenges for advanced packaging applications. Key step and repeat camera technology continues evolving for the mass production of microstructures used for 2.5D and 3D technologies. Wafer and panel stepper configurations for advanced packaging applications are described. Printing smaller features with higher aspect ratios require achieving higher sidewall angles in thick positive resists and polyimides. Higher contrast films have been evaluated to achieve the improvements in performance needed. To help solve these imaging challenges we have leveraged resist modeling software to guide the adjustment of optical parameters. Printing microstructures over larger formats with higher throughput has been accomplished using large magnification adjustment for improving overlay and is validated by characterizing image placement errors over large substrates. Examples of both wafer and panel overlay are provided. Examples of resist performance of printed features are compared.
Jim Webb, Technology Director
Rudolph Technologies
Wilmington, MA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic