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Development of Low Temperature Sintered Nano Silver Paste with Resin Reinforcing Technology
Keywords: sintered silver, high thermal conductivity, solder replacement
Power semiconductor devices and light emitting diode (LED) applications require the efficient removal of heat generated by these devices to optimal performance. Current solutions require using eutectic solders which typical contain lead (Pb) and do not meet RoHS compliance or require Au based solder needing higher processing temperatures, specialty equipment and high material cost. Recent developments in the world of nano-silvers offer a very exciting alternative to the current choices due to the amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes need a surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance but degradation of die shear strength has been found by thermal cycling test due to the fragility of porous structure. To improve the mechanical property, resin reinforcing technology has been developed to fill the porous area and reinforce the sinter structure. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. By curing the paste at 200C for one hour with no pressure, it shows high thermal conductivity of 140 W/mK and very low electrical resistivity of 8 ohm-cm. Furthermore, it shows strong adhesion to metalized surfaces for high reliable during thermal cycles and low thermal resistance due to excellent interfacial contact.
Kenneth Araujo, Regional Manager
NAMICS Technologies, Inc.
ACUSHNET, Massachusetts
USA


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