Micross

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NSOP Reduction of QFN RF-IC packages
Keywords: RF-IC, NSOP -Non stick on Pad, DPPM Reduction
Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. NSOP – Non- stick on Pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction.
Mumtaz Y. Bora, Sr. Staff Packaging Engineer
Peregrine Semiconductor
San Diego, CA
USA


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