Abstract Preview

Here is the abstract you requested from the RAMP_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Design of C-Band Interdigital Filter on Film Substrate
Keywords: Interdigital filter, film, microstrip
Microwave transceiver is an important module in the communication system, it can convert the high microwave carrier frequency and a low intermediate frequency. In this paper, it mainly researches the filter circuit of the C-band transceiver modules. On the basis of microstrip technology, it designs the interdigital filter circuits, and conducts the simulation by means of the electromagnetic simulation software, the results shows that the insertion loss and the out of band rejection conforms to the requirements of the indicator, and the filter circuits meet the using of the system. Under the development of modern electronic technology, microwave communication equipments tend to miniaturization, low cost and high performance. While microwave integrated circuit modules become more and more, the discrete circuit applications will be fewer and fewer. Now microwave integration technology has become mature, and microstrip and microstrip circuit are widely used in microwave integrated circuits due to small size, light weight, low cost and so on. We studies the C-band microstrip interdigital filter, which is used in the transceiver channel. The insertion Loss is less than 2dB. The out of band rejection (2GHz-4GHz, 12GHz-18GHz) is more than 40dB. In order to realize miniaturization, it uses film substrate to design the filter and conducts the simulation by means of the electromagnetic simulation software. In the end of the paper, it uses the vector network analyzer to measure the filter, and the test results show that the performance of the filter reaches usage requirements.
Min Tan,
East China Research Institute of Microelectronics
Hefei, Anhui

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic