Abstract Preview

Here is the abstract you requested from the RAMP_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Assembly Technology Studies in RF & Optoelectronic Packages
Keywords: GaN Die Attach, Eutectic Die Attach, RF Ribbon Bonding
RF & Optoelectronic packages continue to shrink in size with less space and tighter tolerances for die, wires, and ribbons. Packaging engineers are challenged to assemble thinner and more fragile die and are exploring tradeoffs between or combination of eutectic solder and conductive adhesive attachments. A range of eutectic solder attach methods are available in batch reflow or in-situ reflow system. An overview of the methods will be presented along with trade-offs. Levels of automation will also be reviewed. Many RF packages require specialized wire bonding (ball bonding and wedge bonding) to handle unique challenges of deep cavity packages and special loop or ribbon geometries. Some package examples will be presented along with some of the latest advancements in tools to handle the unique challenges of the latest RF packages. A review of tools, guidelines, and actual results will be shared in this presentation.
Daniel D. Evans, Jr., CTO
Palomar Technologies
Carlsbad, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic