Here is the abstract you requested from the RAMP_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Common Refractory Metals Used for Passive Cooling in a Variety of Semiconductor Thermal Transfer Applications|
|Keywords: Passive Cooling, Thermal Transfer, Refractory Metals|
|Commonly available refractory metal materials such as Tungsten (W) and Molybdenum (Mo) and the employed passive cooling techniques of their use offer some of the lowest cost and least complex design solutions for semiconductor industry applications with thermal challenges. Some of the advantages are: 1. Ready availability of material supply 2. Proven performance over many, many decades 3. Relatively short lead times of manufacture in comparison to custom, active cooled designs 4. Typically not a replacement to active cooling but complimentary where high heat load carrying capacity requirements are required This article focuses on the refractory material sets of tungsten and molybdenum that the semiconductor industry is typically familiar with. It is recognized that there are a tremendous variety of materials available for the multitude of applications in industry but is beyond the scope of this article. Therefore, the author will attempt to briefly outline some other materials commercially available that are often seen in similar applications requiring different output performance.|
|Kevin Cotner, President & CEO
San Diego, CA