Abstract Preview

Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Liquid Cooling Today’s High Performance Computers
Keywords: Liquid, Cooling, Systems
Liquid cooling IT equipment, namely, but not limited to high performance computers, is nowadays done very differently than how it has historically been done. Liquids other than water are being used as coolants. Servers are being completely immersed in dielectric liquid filled racks. Two-phase dielectric liquid cooling continues to be explored and is moving closer and closer to adoption. Even tried and true water cooling is being implemented very differently than it was in the past; it is not “your father’s water cooling.” You’ll also find liquid (water) cooling is not being done for the same reasons as it was done previously. This presentation will overview liquid cooling technologies that are in practice today. The general benefits and detractors of liquid cooling vs. traditional air cooling as well as the benefits and pitfalls of the various liquid cooling technologies will be discussed. Categorization of the various liquid cooling implementations at all levels within the data center environment: module, system, rack, data center white space, data center facility, and outside ambient; will be provided. Finally, the relatively new ASHRAE liquid cooling operational classes (W1-W5) will be reviewed.
Michael J. Ellsworth, Jr., Senior Technical Staff Member, Technical Manager, Advanced Thermal Energy Efficiency Lab
IBM Corporation
Poughkeepsie, NY

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems