Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Low-Cost Implementation of Application-Oriented TIM Measurement System|
|Keywords: TIM, Thermal Resistance, Measurement|
|When attempting to select Thermal Interface Material (TIM) for a given application, the best approach is to use various materials in the actual thermal environment and make measurements to determine which material offers the best overall performance. However this approach may not be practical for several reasons – the thermal environment is • not fully defined, • not readily available, • not amenable to measurement implementation, and/or • not consistent with timeline requirements. An alternative approach is to use a measurement setup that simulates the actual application environment in which the material will be used. This presentation will describe the theory and application of a very simple approach for making TIM thermal resistance measurements for comparative purposes. Using readily available components combined with easy-to-use software, the user can quickly perform repeat measurements on the same material, different material, or different environment conditions. There is also capability for making measurements for temperature spatial mapping purposes.|
|Bernie Siegal, President
Thermal Engineering Associates, Inc.
Santa Clara, California