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|Thermal management of hotspots using liquid cooled heterogeneous pin-fin enhanced microgaps|
|Keywords: Thermal management of hotspots, non-uniform pin-fin array, Heterogeneous pin-fin|
|In an effort to meet the increasing demand of heat dissipation of ICs, single-phase liquid cooling technology has been successfully implemented. Fluid flow occurs within microchannels or micorgaps in these applications. The use of surface enhancement features allows for heat transfer enhancement, as well as the ability to route electrical interconnects. However, there still remains a thermal challenge in effectively managing localized hotspots in multicore ICs. The non-uniform pin-fin array enhanced microgap liquid cooling technology offers an opportunity to overcome the increasing thermal challenge of multicore architectures. In this paper, an overview of thermal and pressure drop of selected heterogeneous pin-fin enhanced test device vehicles (TDVs) with non-uniform fin array will be provided. The TDVs are fabricated as four background heaters located from the upstream to downstream, and one additional heater as hotspot located in the center. Thermal performance of cylindrical pin TDVs and hydrofoil fin TDVs will be presented. Both are of two types: one with fin density increasing around the hotspot only, the other where it increases along the spanwise direction as well. Deionized water (DI) is used as the coolant for all the test cases with heat flux varying from 125W/cm2 to 625W/cm2 for the hotspot and 125W/cm2 to 250W/cm2 for background heaters. The heat flux ratio of the localized hotspot to background heaters varies from 1 to 5. The TDV of hydrofoil spanwise density increased fins achieved the best thermal performance, about 6% to 14% lower hotspot temperature than others. The TDV of cylindrical spanwise density increased fins kept a balance between hotspot cooling performance and pressure drop. In general, as the hotspot temperature remains around 70 ℃ with heat flux of 625W/cm2, the non-uniform fin enhanced microgap cooling technology appears to be a promising hotspot thermal management approach, under moderate background heat flux.|
|Yuanchen Hu, Graduate research assistant
Georgia Institute of technology