Micross

Abstract Preview

Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Metal Enhanced Thermal Gap Filler Investigation
Keywords: Thermal Gap Fillers, Thermal Testing, Analytical Modeling
The thermal conductivity of organic thermal gap fillers that are sufficiently compliant to be used on electronic components is typically on the order of ~1% that of metals. Alternative gap filler approaches using high conductivity particles or structures such as carbon nanotubes have demonstrated improvements in the thermal performance of these fillers. However due to cost, reliability or manufacturing concerns improvements in the thermal performance of gap fillers tends to be incremental. This presentation will discuss a relatively simple approach for enhancing the thermal performance of gap filler materials by incorporating a compliant metal structure into the gap filler itself. Test data shows that the effective thermal conductivity of a commercially available material was doubled while analytical predictions show that this approach could potentially improve thermal conductivity by nearly a factor of 10.
Ross Wilcoxon, Principal Mechanical Engineer
Rockwell Collins
Cedar Rapids, Iowa
United States


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems