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Advanced Cooling Techniques and Thermal Design Procedures for Airborne Electronic Equipment - revisited
Keywords: Avionics, Historical Review, Projected Future Trends
“Advanced Cooling Techniques and Thermal Design Procedures for Airborne Electronic Equipment” was the title of a research proposal that was submitted by Collins Radio Company to the United States Air Force System Command in November, 1968. This presentation will describe the electronics cooling approaches addressed in that proposal and how technologies used in avionics have progressed over the nearly half-century since it was written. Lessons learned from reflecting on this previous work, combined with reviewing trends in electronics packaging and aerospace systems, will be used to assess what the future looks like for thermal management of avionics. A version of this presentation was given at the 2016 ITHERM conference.
Ross Wilcoxon, Principal Mechanical Engineer
Rockwell Collins
Cedar Rapids, Iowa

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic