Micross

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Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Vapor Chamber and Heat Pipe Heat Sink Design Employed For Cooling of Multiple High-Power Heat Sources Under Varying Operating Conditions
Keywords: Vapor chamber, Heat pipe, Heat sink
Large size heat sinks with vapor chamber and heat pipe base structure are designed for application with multiple high-power heat sources, and measured and simulated under different operating conditions with uniform and non-uniform airflow and power distribution. Study reveals some of the important design considerations for working with these type of two-phase cooling devices and the benefits and drawbacks of the technologies.
Jaana Behm,
Futurewei Technologies
Santa Clara, CA
USA


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