Abstract Preview

Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Microsoft Surface Pro 4 Thermal Architecture
Keywords: mobile computer, thermal design, thermal module
The Microsoft Surface Pro 4 represents a completely new approach to mobile device thermal management. By utilizing every available mode of heat transfer available, the designers were able to manage significantly higher heat dissipation rates than previous devices. The thermal module utilizes over 65% of the devices surface area for heat rejection as well as heat storage. Furthermore, a state of the art dual exhaust centrifugal blower provides additional cooling enabling the Surface Pro 4 to fully deploy Intel's Skylake core i7 processor sustaining turbo power levels of 25 W for up to 15 minutes before stabilizing at a steady state dissipation rate of 15 W. This presentation will provide insight into the challenges of managing such high power levels in an 8.45 mm thick tablet.
Andy Delano, Senior Thermal Engineer
Redmond, WA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems