Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Specialized Metallic TIMs for Non-Flat Surfaces and Burn-in/Test Applications|
|Keywords: Thermal Interface, Burn-in/test, Developments|
|Indium Corporation has undertaken a program to develop improved thermal interface materials, which are cost-effective for both TIM2 and burn-in test applications. HSMF is a unique multilayer TIM which can accommodate surface warpage over large areas and also with its unique construction, can facilitate internal X,Y spreading of heat to allow effective heat removal and the minimization of hot spots. This material was designed for TIM2 applications but can also be used in TIM1 applications as well. HSMF-OS is a 4 mil thick composition containing an Aluminum layer which will face the devices to be tested and a unique non-silicone thermal compound for contact with the thermal test head. HSMF-OS can also be modified with a thicker thermal compound layer to accommodate larger surface warpage across the devices to be tested. In this paper, we will present both thermal and performance data on both materials.|
|Ron Hunadi, Market Development Manager, Semiconductor Materials