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Design of an Improved Flow Control Device for Dynamic Cold Plates to have Distributed Cooling in a Water Cooled Multi Chip Module
Keywords: Dynamic Cold Plate, Flow Control Device, Distributed Cooling for Multi-chip Module
Electronics cooling research is facing the challenges of high heat flux removal and increased pumping power. Lots of work have been done to improve the cooling efficiency of data centers at the rack, room and facility level. Conversely, not as much attention has been focused related to module level cooling. The continued increase in heat fluxes at the chip level due to new and robust technology nodes following Moores law is starting to push the limits of air cooling and especially for high end servers. An alternative to air cooling is liquid cooling. It is a technology that has been used since the early 80s by IBM and at the time using indirect liquid cooling. With the introduction of multi-core chips and corresponding highly non-uniform power distribution, the traditional static cold plate could result in large temperature gradients across the die. As such, there arises a need to have a dynamic cold plate which distributes the coolant as per the power distribution of the die and hence potentially decrease the temperature gradient across the die. In the test setup, the static cold plates were replaced by dynamic cold plates. Numerical Analysis is done to validate the experimental work and to optimize the performance limiting parameters of the dynamic cold plate. It was shown that a significant reduction was accomplished by using the dynamic cold plate. Furthermore, optimizations of the parallel plate fin in the dynamic cold plate indicated significant improvements in pumping power performance. The optimized dynamic cold plates have shown over 28 % and 52% of reduction in pumping power and average temperatures across the module respectively. In all dynamic cold plates, flow control device have to be used. Our first generation state of the art flow control devices require dampers, actuators, sensors, transducer and control module. This approach makes the system complex and reduces its reliability because it requires integration of N number of elements. Moreover, it requires downtime and extra spares for inspection and maintenance. Hence we proposed to use a new method to overcome this challenge. In this study of flow control device, various materials that are sensitive to temperature, super elastic and have shape memory properties in bi-metallic, alloy, polymeric and composite domains are shortlisted. Selection Parameters of damper size, hydraulic diameter for the full load condition and minimum load condition, power consumption for various geometries and fluid mediums, external heater placement, active and passive flow control schemes, different geometries, material required to overcome the hydraulic pressure and the location of flow control device are investigated. Moreover, even the design parameters to have reliability for 10^7 cyclic loading is considered. Electronics, MEMS and Nano Electronic Systems Packaging Center, University of Texas at Arlington Principal Investigator (agonafer@uta.edu)
Kunal Atulkumar Shah, Graduate Student
University of Texas at Arlington
Arlington, Texas

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