Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development and Application of Copper-Graphite Composite Thermal Control Cores for High-Reliability PCBs for GaN RF System|
|Keywords: CTE-Matched, GaN RF, PCB|
|A description will be given of recent developments for composite CTE-matched thermal control cores for complex multilayer organic printed circuit boards which provide: a. High in-plane and through-plane thermal conductivity; b. Selected CTE values tailored to match device CTE (GaN, SiC, or Si); c. Manufacturing suitability for replacement of heavy copper thermal layers within high-reliability multilayer PCBs. This presentation will: - Identify market requirements and needs; - Describe development and applications of large panel forms of very thin copper-graphite composites manufactured to meet targeted thicknesses; - Show comparative test data for thermal conductivity, CTE, density for related materials; - Illustrate applications and provide examples. This development program includes testing by a major aerospace manufacturer for development of thermal control core materials for complex PCBs set targets. A European Union OEM undertaken a design and test program for innovative phased array radar modules using this concept. Examples will be shown. Development of thermal control core materials for conduction-cooled printed circuit boards with as many as 21 layers, for high heat flux GaN RF to be soldered has recently been completed for the initial target material requirements. A stretch goal has been completed. Testing and analysis of PCB manufacturing processes utilizing these composite panels were conducted by three PCB manufacturers (two US, one EU-based), with manufacturability prove-out. Complex multilayer RF PCBs have been manufactured for seven different programs and are in test. A manufacturing cost reduction program for core materials is underway.|
|David L Saums, Principal