Micross

Abstract Preview

Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Phase Change Material (PCM) Implementation within Mobile Devices
Keywords: PCM, Mobile, Phase Change Material
Phase Change Material (PCM) Implementation within Mobile Devices As power consumption due to delivering rich content or performing interesting functions in mobile devices is on the rise, it is important to delay the thermal mitigation for as long as possible. Thermal mitigation is triggered when either the skin temperature of the product or the junction temperature of components within the mobile device reach their respective maximum. The latter may be delayed when PCM is in contact with high-power heat sources, hence providing a larger thermal budget for transient activities. This study presents data on temperature and time-to-mitigation metrics when PCM vs. non-PCM thermal solutions are employed. In addition, it highlights the magnitude of impact on delays based on reasonable volumes of PCM that may be utilized within mobile devices.
Nader Nikfar, Principal Engineer
Qualcomm
San Diego, California
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems