Here is the abstract you requested from the Thermal_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Past, Present, Future for Flexible Ground Planes|
|Keywords: Ground Plane, Thermal, Flexible|
|A flexible thermal ground plane is designed and manufactured using printed circuit board (PCB) technologies. Different flexible TGPs demonstrated will be reviewed with an emphasis on the world's thinnest vapor chamber that is only 0.25 mm thick. Unique features and challenges of this thin and flexible TGP will be discussed. Future flexible TGPs will be illustrated using an all polymer TGP as an example. The enabling technology for such a TGP is roll-roll atomic layer/molecular deposition (ALD/MLD). How thin can future flexible TGPs reach? Is it 100 um or even thinner? A theoretical analysis will be presented to gain an insight into this opportunity.|
|Y,C. Lee, Professor, Mechanical Engineering
University of Colorado