Here is the abstract you requested from the Wirebonding_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Lowering the cost of wire bonding with the latest technology|
|Keywords: Cu wire bonding, Ag wire bonding, multi-tier looping|
|The desire of providing more functionality at lower cost has driven the growth of semiconductor industry since its inception. Among the different interconnect technologies such as wire bonding, flip chip and TAB bonding, wire bonding is almost always the lowest cost and the most flexible interconnect solution, therefore, it remains the most popular interconnect method. Around 85% of the semiconductor packages are wire bonded today. Lowering the cost of wire bonding technology is vital to the continuing growth of the semiconductor industry. Some of the main cost components are material, labor, time to complete the task, tooling cost, depreciation of the equipment, and cost due to yield loss. We will discuss how the advances in wire bonding help to further reduce the cost of packaging. We will look into several key areas including cost of material, cost of labor and time, and productivity and yield improvements. One major cost reduction is in bonding wire. Au wire is much more expensive than alternative wires such as Pd coated Cu wire, Cu alloy wire, Ag alloy wire. By going to a lower cost wire, package cost can be reduced by 20%. Another area of cost reduction is the lower cost substrate technology such as PPF QFN. Advanced equipment and process technologies can help retain the material cost saving by ensuring robust and fast bonding processes. For today’s advanced node devices with complex looping requirements, the 3D looping tool can help shorten the design cycle, reduce costly redesign, improve wire bond yield which in turn enables wire bonding more complicated advanced node devices at a lower cost. Improving the wire bonding yield is another effective way to reduce the package cost. Advanced auto-recovery features on the wire bonder such as the automatic recovery from short tail and non-stick on lead can reduce the yield loss due to operator error and improve net UPH. The more robust processes and better oxygen free environment have all demonstrated improved package yield. Machine to machine portability is also important to have good production yield. Since one recipe is normally used across a large population of machines, bonder portability can ensure optimal performance on all of the machines. A lot of effort had been put in to develop tools on the bonder to automatically calibrate key subsystem performance.|
|Ivy Qin, Director of Process R&D
Kulicke and Soffa
fort washington, pa