Here is the abstract you requested from the Wirebonding_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|CWB (Capillary Wedge Bonding) Wire Bonding Technology using a Ball Bonder|
|Keywords: Wedge bonding, Capillary wedge bonding, Chain bonding|
|Historically ball bonding and wedge bonding have been performed on separate machines due to their mutually exclusive wire bonding processes. Ball bonding has been done at relatively high speeds using bonding wire passed at 90 degrees through a capillary. Wedge bonding, on the other hand, has been done at relatively low speeds using bonding wire passed front-to-back through a wedge tool at typical angles of 45 or 60 degrees, or rarely at 90 degrees. The low angle of the wire feed forms an obstruction to bonding access compared to ball bonding. In addition, due to the unidirectional nature of wedge bonding, it has been necessary to physically re-align the bonding tool or workpiece in the theta axis with each successive wire in order to place wires at a full 360 degrees, consuming considerable time. The restricted access and relatively low productivity of wedge bonding have limited its application compared to ball bonding, despite wedge bonding’s inherent advantages including its unique capability of bonding aluminum wire which cannot be ball bonded due to the physical properties of aluminum. A new bonding technology has been introduced called “CWB” (capillary wedge bonding) using a conventional ball bonder platform and capillary to produce wedge bonds with various wire types including gold, aluminum, silver, copper and palladium copper. In addition to wedge-wedge bonding, one-pass combination bonding is possible such as wedge-wedge-wedge continuous chain bonding, and ball-wedge-wedge continuous chain bonding. Like ball bonding, CWB can proceed at 360 degrees from the first bond, facilitating high speed operation. Improved UPH is attained depending on the device structure, such as for NAND Flash and others. In applications involving the cascade bonding method which otherwise requires BSOB bonding, CWB can achieve 2X or more UPH improvement.|
|Yoshihito Hagiwara, General Manager of Technical Marketing Dept.