Here is the abstract you requested from the Wirebonding_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Understanding the Role of Ultrasonic Welding in Wire Bonding|
|Keywords: Ultrasonic bonding, wire bonding, Interconnection|
|Wire bonding is a high-speed ultrasonic welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. Ultrasonic energy is the principal process parameter affecting the deformation of the ball and the bond pad or substrate. Deformation of both the ball and the bond pad are required to form the intermetallic weld. Understanding of the process and the effect of ultrasonic energy on the deformation behavior of the materials is a key to achieving high-yield, high-reliability interconnections. This paper will discuss the role of ultrasonics in the deformation of a material and its relationship to weld formation. It will also explain a number of key machine dependent variables such as ultrasonic frequency and control mode (constant voltage versus constant current modes) and their relationship to weld formation.|
|Lee Levine, Consultant
Process Solutions Consulting
New Tripoli, Pennsylvania