Here is the abstract you requested from the Wirebonding_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Aluminum alloy bonding wire for high temperature power devices.|
|Keywords: high temperature, thermal fatigue fracture, high reliability|
|The goal is to introduce a new Aluminum alloy wire which is suitable for high reliability thermal applications. The new Al wire incorporates higher thermal fatigue resistance than conventional Al wires. The presentation will compare grain size with traditional Al wires and show comparisons of tensile strength and heat resistance.|
morgan hill, ca