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Here is the abstract you requested from the Wirebonding_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Fine Wedge Bond Applications Survey and Process Tools
Keywords: Fine Wedge Bond, RF Package, Ribbon Bond
Modern wedge bonders have evolved since their early inception in 1957. Although the dominant share of wire bonds are produced by ball bonders, there are several markets and technologies which require wedge bonding. There two major segmentation categories in wedge bonding; 1) Manual/Automatic and 2) Fine/Heavy. The focus of this extended abstract is on Automatic Fine Wedge Bonding and will cover a range of application examples that help process engineers determine machine configuration and features available to solve their wedge bond assembly needs.
Daniel Evans, Chief Technical Officer
Palomar Technologies
Carlsbad, CA
USA


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