Here is the abstract you requested from the asp_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Semiconductor Assembly and Materials Reliability for Evolving Automotive Electronics Applications|
|Keywords: Materials, Die-Attach, Automotive|
|Andy C Mackie and Ning-Cheng Lee Abstract: Major changes in the nature, complexity and criticality of electronics in automotive usage are creating new challenges in semiconductor assembly materials and processes in ensuring finished device reliability. This paper will review changes foreseen for the automotive industry, their impact on electronics in automotive, and how materials suppliers are rising to meet these challenges. Topics to be discussed: - Challenges to materials suppliers developing and testing materials for the automotive semiconductor assembly industry - High temperature Pb-free solder paste for die-attach in discrete components and modules - Sintering materials for die-attach for wide-band gap (GaN and SiC) devices - Bondline thickness control in IGBT module die-attach using solder preforms|
|Andy Mackie, Senior Product Manager