Here is the abstract you requested from the asp_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Impact of new Generation Chemical Treatment Systems on High Frequency Signal Integrity|
|Keywords: High Density, High Frequency Signal Integrity, Chenical Treatment impact|
|The High Density Packaging (HDP) user group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df loss measurement results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre- lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion.|
|James Fuller, Vice President, Engineering and Technology Development