Abstract Preview

Here is the abstract you requested from the HITEN_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Creation of an ARM(C) Cortex(C)-M based microcontroller for high temperature embedded systems
Keywords: microcontroller, microelectronics, embedded
This paper will describe the development and testing of a new ARM(C) Cortex(C)-M based microcontroller for high temperature electronic systems. The trade-offs in the selection of each on-chip peripheral will be discussed with respect to their requirement in the application. Particular detail will be afforded to the underlying high-temperature implementation technology that allows reliable operation at extreme temperatures. High temperature and electrical overstresses can cause latch-up in CMOS devices that will interfere with normal device operation or destroy the device. For reliable operation in the downhole drilling environment it was necessary to immunize this device against latch-up using an innovation processing technique. In addition, many fault-tolerant and fault-avoidance hardware sub-systems have been developed and incorporated into the architecture to ensure predictable and reliable operation. Details on the qualification and testing of the product to ensure that it meets the challenging environment will also be discussed. This includes electrical testing and temperature cycling testing to ensure that the different package options for the silicon device are mechanically sound in a high temperature environment that exposes the silicon and packaging materials to thermal cycling. The ecosystem for the microcontroller will also be discussed � hardware and software development tools are required to optimize the use of the device in extreme temperature embedded systems. An ecosystem of components is also required to operate with the microcontroller in the high temperature harsh environment. The components that were selected for use on the high temperature test boards will also be discussed.
Ross Bannatyne, Director
VORAGO Technologies
Austin, Texas

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic