Here is the abstract you requested from the HITEN_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reducing Die-Attach Voids in Gold-Based Solder Preforms|
|Keywords: Die-attach, high-reliability, void-reduction|
|ABSTRACT: Reducing Die-Attach Voids in Gold-Based Solder Preforms Bernard Leavitt Introduction The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller and power density and power ratings increase. AuSn20 solder has been the workhorse for many years for small high-temperature, high-reliability die-attach applications. Unfortunately, as junction temperatures (Tj) increase, gold-tin eutectic is beginning to reach its limit. This paper will discuss how voids can be minimized to improve heat transfer and reliability with the usage of higher melting, gold-based alloy preforms.|
|Bernard Leavitt Jr, Product Specialist
Indium Corporation of America