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The Tamessa project: a practical application of a 225C multilayer PCB/SMT/COB system
Keywords: 225degC, PCB, SMT
The Tamessa project has developed a high temperature multilayer Printed Circuit Board and component assembly process that is capable of withstanding 225C operating temperatures in a non-hermetic environment. This paper describes the practical application of this project’s work to the electronic interface for a high temperature pressure sensor. The PCB used in Tamessa has been made from novel materials and the Surface Mount Technology component attach process is a solder-less process that uses an adhesive. Additionally, the project has developed and proved a Chip on Board system. The combination has enabled the development of a complete assembly system that has been shown to withstand temperature excursions up to 250C in a non-hermetic environment. The successful application to a pressure sensor, designed to resist temperatures of 210C, was a further test to demonstrate its practical capability in a real life situation.
Piers Tremlett,
Microsemi
Portskewett, Monmouthshire
UK


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