Here is the abstract you requested from the HITEN_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Tamessa project: a practical application of a 225C multilayer PCB/SMT/COB system|
|Keywords: 225degC, PCB, SMT|
|The Tamessa project has developed a high temperature multilayer Printed Circuit Board and component assembly process that is capable of withstanding 225C operating temperatures in a non-hermetic environment. This paper describes the practical application of this project’s work to the electronic interface for a high temperature pressure sensor. The PCB used in Tamessa has been made from novel materials and the Surface Mount Technology component attach process is a solder-less process that uses an adhesive. Additionally, the project has developed and proved a Chip on Board system. The combination has enabled the development of a complete assembly system that has been shown to withstand temperature excursions up to 250C in a non-hermetic environment. The successful application to a pressure sensor, designed to resist temperatures of 210C, was a further test to demonstrate its practical capability in a real life situation.|