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Effect of isothermal aging at 250 ℃ on shear strength of joints using Sn-Coated Cu particle paste for high-temperature application
Keywords: transient liquid phase bonding, isothermal aging , high-temperature application
Abstract: As a recent trend, the silicon carbide (SiC) is of particular interest for semiconductor device. The SiC power device provides the possibility to develop the next- generation power conversion circuit with high efficiency and high power density. Compared with the conventional silicon (Si) device, the SiC device can operate with significant lower power loss and higher operating temperature, which contributes to miniaturization and higher performance of power modules. To assemble these power modules, the high temperature packaging technology such as die attach process is needed. As a die attach process, we focus on a transient liquid phase (TLP) bonding, which can be operated at a low temperatures while resulting in higher re-melting temperatures of bonded joints. However, some drawbacks of this technology still remain. For example, the duration of this process is too long, up to a few hours, and multiple hours of annealing are required to achieve a thermodynamically stable joint. So we are studying on a TLP bonding using Sn-coated Cu particles to reduce the bonding process time. In this study, we evaluated the effect of isothermal aging at 250 ℃ on the shear strength of Cu/Cu joints using a Sn-coated Cu particle paste and investigated a high temperature reliability of the joints. As a result, a thermally stable joint fully comprising Cu3Sn phase with a dispersion of Cu particles could be obtained after sintering for 30 s at 300 ℃ under a formic acid atmosphere. The shear strength of the joint before isothermal aging was about 25 MPa and the shear strength after isothermal aging at 250 ℃ for 1000 h was more than 25 MPa.
Hiroshi Nishikawa, Associate Professor
Osaka University
Ibaraki, Osaka

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