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Development of thermal conductive sheet with low interfacial heat resistance
Keywords: Inter facial heat resistance, modulus, resin
High thermal conductive sheet is important for development of high power applcations such as an inverter. However most cases materials development is focusing on the materials thermal conductivity(1,2). In this paper, authors are measured the mesurement of interfacial heat resistance by steady-state method(3). And we found the effect of material property on the interfacial heat resistance. From those results, we developed the heat conductive sheet with extreme low interfacial heat resistance. In addition, the material shows good heat resistance (>300C). It is suitable for high temperature operation power devices such as SiC.
Masao Tomikawa, Research Fellow
Toray Industries
Otsu, Shiga
USA


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