Abstract Preview

Here is the abstract you requested from the HITEN_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Development of thermal conductive sheet with low interfacial heat resistance
Keywords: Inter facial heat resistance, modulus, resin
High thermal conductive sheet is important for development of high power applcations such as an inverter. However most cases materials development is focusing on the materials thermal conductivity(1,2). In this paper, authors are measured the mesurement of interfacial heat resistance by steady-state method(3). And we found the effect of material property on the interfacial heat resistance. From those results, we developed the heat conductive sheet with extreme low interfacial heat resistance. In addition, the material shows good heat resistance (>300C). It is suitable for high temperature operation power devices such as SiC.
Masao Tomikawa, Research Fellow
Toray Industries
Otsu, Shiga

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic