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Thermosyphon Applications for Power Semiconductors
Keywords: Thermosyphon, IGBT, Power Electronics
Thermosyphons are often considered to be an extension of the more common heat pipe and have been used in series production for IGBT module thermal management only in very selected applications. While much university research has been conducted on this component type, it is useful to examine why and how thermosyphons have been applied in electrical drives in certain applications, as well as both the attributes and the restrictions inherent in this technology. This presentation will compare several different type of passive two-phase components (heat pipe, vapor chamber, and thermosyphon) and how performance and technology limits apply in comparison to single- and two-phase pumped liquid cooling systems. Several tables will be used to illustrate how each of these passive and active liquid cooling technologies perform in ground-based, airborne, and space applications with the influence of gravity and acceleration and mounting attitude; what types of fluids are available for use as coolants in industry applications of these types of systems; and what advantages and disadvantages in major industry segments, such as electrical drives, may apply. Please let me know if this is sufficient and of interest to the organizers and audience. The goal is to present on these technologies with as little commercial content as possible, so that the audience gains a balanced understanding of these various technologies including thermosyphons. Primary focus will be for use with IGBT power semiconductors in power electronic systems, as these are the critical keys to energy efficiency improvements across a very wide range of industry and market segments.
David L. Saums, Principal
DS&A LLC
Amesbury, MA
USA


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