Here is the abstract you requested from the Thermal_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Management Solutions|
|Keywords: Micro Heat Spreader, Micro Heat Sink, Submount|
|3D Glass Solutions offers a portfolio of thermal management solutions in the form of Micro Heat Spreaders, Submounts, and Heat Sinks. This set of technologies provides tiny custom structures to product designers and packaging engineers who are faced with the most challenging thermal management and TCE issues. These thermal management devices are as thin as 300um with areas as small as 1mm x 1mm. Micro Heat Spreaders and Submounts are dual surfaced structures with 1,000's of solid copper pillars to transfer heat from source to sink. Thermal transfer capability up to 120W/m-K is offered. In addition, custom designs can incorporate electrical signal lines for circuit routing and interconnection. Micro Heat Sinks are single sided devices for placement on package surfaces offering thermal conductivity to 3W/cm2.|
|Jeb Flemming, CEO/CTO
3D Glass Solutions