Here is the abstract you requested from the Thermal_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3D Chip Stack Cooling of High Power Electronics|
|Keywords: Thermal Packaging , GaN Power Electronics , ICECool|
|Innovative methods for “thermal management” – High Power Electronics (microchips), especially for RF MMIC (GaN on SiC, Diamond) Amplifiers and Embedded Super Computers is the focus of current research efforts . The electronics get hot by integration of thousands of components at the device level (miniaturization), increase in power amplification, and in efforts to address the goals of Size Weight and Power (SWaP) requirements . The focus of current works is to “stack” microchips in a small footprint area, and apply microfluidics cooling to remove heat from multiple hotspots and background regions of the micro-chips. Also, a thin film of thermoelectrics is applied at top surface of substrate for heat pumping very high levels of heat density. The “substrate” on back side of electronics device has – novel design of structures in|
|Sumeer Khanna, Faculty Research Assistant
Calce, Dept. of Mechanical Engg., Univ. of Maryland