Here is the abstract you requested from the Thermal_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Design of Consumer Electronics and a Reduced Order Modeling Approach|
|Keywords: consumer electronics, thermal , design|
|User experience has been the main focus of handheld device design. Therefore, defining appropriate temperature specifications and maximizing components performance are critical. This paper will review existing industry standard and propose safety and touch temperature specifications for handheld devices to ensure thermal comfort. Thermal design considerations to balance components performance and thermal comfort will be discussed. Common industry practices on thermal design of handheld devices includes numerical simulations using customized code or commercial software. In many cases, quick turnaround time is required due to design iterations such as ID variation, new software feature request or board redesign. In this paper, we will explore a reduced order thermal modeling approach to reduce the design cycle significantly.|
|Zhihua Li, Manager, thermal design
San Jose, CA