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Analytical thermal analysis of bare die and lidded die cooling
Keywords: electronic cooling, thermal management, chip packaging
Increasing power density of electronic chips keeps pushing the cooling solution to extreme optimization. In recent years, bare die (direct die) starts to appear in high power applications with a large die size, replacing the conventional lidded packaging [1]. However, there is no clear and practical design guidance due to the vast parameter space and a lack of systematic studies. In this work, an analytical study is conducted to assess the sensitivity of various parameters on the thermal spreading resistance (TSR) and the total thermal resistance (TTR) for a typical chip cooling structure with the square source and sink. The typical cooling structure is modeled as a finite heat sink base with rectangular heat source on the base’s top surface. The heat source area has uniform heat flux. The heat flows through the heat sink base and flows out of the base’s bottom surface into a convective environment with a constant convective heat transfer coefficient. All other base’s surfaces are adiabatic. An analytical solution of this model is obtained [2] and a Matlab code is developed to study the sensitivity of TSR and TTR on the selected parameters. The selected parameters include heat source size, heat sink size and base thickness, thermal conductivity of heat sink and thermal convective coefficient. In summary, the presented findings provide a practical guidance to design an optimum cooling solution for specific applications.
Xiaopeng Huang, Staff Thermal Engineer
Futurewei Technologies
Santa Clara, CA
United States

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