Abstract Preview

Here is the abstract you requested from the Thermal_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Novel Solutions for High Power and High Temperature Die Attach Applications
Keywords: 300C Operating, High Thermal Conductivity, Sintered Silver
High power semiconductor applications require a die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current die attach solutions such as eutectic solders and high thermal conductive silver epoxies and sintered silver adhesives have been industry standards, however may fall short in performance for high temperature or high stress applications. This presentation will discuss the fundamental study of three key cutting-edge technology solutions for high power Die Attach Application; which includes: MO (Metallo-Organic) Technology, Silver Fusion Technology and Silver Glass Technology. For example, the Ag-Glass High Thermally adhesives are designed for a continuous use temperature of 300C with SiC devices with a die attach process at about 370C. The Ag Fusion Technology characterizes low storage modulus and high thermal conductivity with continuous operating temperature of up to 250C. The Nano silver pastes using MO technology and resin reinforcing technology poses very high thermal conductivity and meets industry standards reliability requirements. Maciej Patelka - Area Manager NAMICS Technologies, INC. San Jose, CA.
Maciej Patelka, Area Manager
NAMICS Technologies
San Jose, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic