Abstract Preview

Here is the abstract you requested from the Thermal_2017 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Hybrid Cooling of High Power Router and Servers
Keywords: Hybrid Cooling, High Power Router, Servers
To meet the continuing demand of system critical equipment’s higher power density like telecom electronics, a new way of thinking about how to cool these electronics is needed. As the power density in these boxes keeps increasing, current air only cooling solutions are not going to be able to meet future demands. As a result, several solutions are being created to use liquid cooling solutions to meet this demand. However, these cooling solutions require expensive drip free valves and take up valuable space that could be better used for IO communications. Some customers are also weary of putting any fluid into their very expensive electronic equipment because of their fear of leaks an or condensation forming on these cooling loops. This paper will introduce the concept of Hybrid Cooling where the use of traditional air cooling and liquid cooling is combined to enable the cooling of high power equipment without the need to bring expensive liquid cooling loops inside the box. The pros on and cons of this new way of cooling as well lessons learned will also be discussed. Hybrid cooling is all about thinking outside the box.
Juan L Cruz, Thermal-Mechanical Engineer
, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems