Device Packaging 2019

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Glass bonding technology of FeSiCr substrate and fired NiCuZn ferrite substrate
Keywords: FeSiCr alloy powder, NiCuZn ferrites, glass bonding
The materials and process of the ferrite-metal composite multilayer power inductive devices was developed to increase the insulation resistance and breakdown voltage of the FeSiCr alloy power inductors. A new innovative adhesion process and mechanism of glass to FeSiCr alloy using the redox reaction was developed. The effects of CuO content in Bi-B-Si-Zn glass on the interfacial reaction between the glasses, FeSiCr alloy powder and NiCuZn ferrites, microstructure and adhesion strength were investigated. It was observed that the glass can physically bond with NiCuZn ferrites by the impregnation of glass melt into the pores of NiCuZn ferrites. For the interface between FeSiCr alloy and glass, the iron in FeSiCr alloy dissolved into glass and was oxidized into Fe3+ during heating. To maintain charge neutrality, the copper ions in the glass were reduced to elemental copper near the interface, which led to the chemical bonding between FeSiCr alloy and glass at 750C under air atmosphere. The CuO in the glasses increased wettability and adhesion between FeSiCr alloy and glass. Due to redox reaction, the spherical copper- rich precipitates near the interface could inhibit the crack propagation by Vickers indentations but the presence of the pore in the glass layer would decrease the adhesion strength. Moreover, the amount of element copper precipitates increased as the heat treatment temperature was raised to 800C and 850C, leading to the increase in the adhesion strength between glass and FeSiCr alloy.
Hsing-I Hsiang, Professor
National Cheng Kung University
Tainan, Taiwan

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