Device Packaging 2019

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Characterization of a New and Complete Lead‐Free Thick Film Resistor System for the Hybrid Circuit Market
Keywords: lead free, thick film resistors, hybrid circuit
The move to lead‐free thick film technology, including resistors does not necessarily mean a move away from performance. There have been many recent developments in the area of lead‐free glasses, thick film dielectrics, and conductor materials. However, the development of lead‐free resistor materials has been slower to enter the market. This slower evolution is due, in part, to the need to develop a series of discrete compositions that are compatible with each other and cover a wide range of resistance values. There can be 8‐10 individual members in such a series. The primary goal of this development was to achieve resistor performance on par with, or superior to an existing and popular premium lead based resistor system. This paper describes a new series of lead‐free thick film resistor compositions that cover a complete range of decade values from 1 Ohm/square to 10 MegOhms/square. Each member is compatible and blendable with adjacent members to cover all possible resistivity needs. This system provides excellent environmental stability of laser trimmed resistors, tight TCR gap control, a wide processing latitude, and minimal termination effects with a wide range of lead‐free conductor metallurgies including Au, Ag, Ag/Pt, and Ag/Pd. In this paper, we report the results of a characterization study that includes 1000 hours of laser trim stability in 85ᵒC/85%RH, thermal ageing at 150ᵒC, room temperature ageing, and thermal cycle stability at ‐50ᵒC +150ᵒC. Electrical properties are presented and include Power Handling, Quan‐tech Noise, and Electrostatic Discharge stability. In addition, this paper investigates and documents: resistor length effects, fire and refire sensitivity effects, thickness behavior, and the use of lead‐free encapsulation.
John Oleksyn, Technical Specialist
DuPont UK
Bristol, n/a

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