Device Packaging 2019

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Miniaturized laser structured components in LTCC for 5G applications
Keywords: laser structuring, LTCC, 5G
For 5G applications small components on surface or embedded structures with operating frequencies up to 26 GHz will be important. Concurrently the requirements of these components regarding structural quality increases with smaller geometric dimensions of such integrated structures. RF circuits, e. g. filter and transformation networks can be realized with distributed components or line structures as well as using lumped elements. Concentrated or lumped components, e g. coils and capacitors and their interconnections fulfil the requirements of the ongoing miniaturization satisfactory. Conversely, line structures will be always bigger and thus the resulting interconnections. The LTCC technology is a promising candidate to realize such components and their combination to small RF circuits. Regarding to the requirements for such components working up to 26 GHz, small geometrical dimensions, e. g. a coil having a diameter below 500 m, must offer line widths and spaces smaller than 30 m, the accuracy and the repeatability of standard screen printing technologies are insufficient. The laser structuring of screen printed thick films on LTCC with a pulsed picosecond laser allows the manufacturing of structures with dimensions down to 20 m size, concurrent with accuracies and reproducibilities smaller 1 m. Furthermore the advantage of this technology is the producibility on the top layer of the multilayer substrate in a cofire or postfire process as well as for buried structures [1]. This paper will present simulation results and the technological realization of small lumped components usable for RF circuits in 5G applications applying the LTCC technology. Mainly the results of the laser structuring and the comparison of the buried and top layer components will be discussed, referring accuracy and repeatability as well as functionality during RF measurements.
Nam Gutzeit,
TU Ilmenau
Ilmenau, Thuringia

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic